Référence fabricant
25AA256T-I/SN
25AA256 Series 256 Kbit (32K x 8) 5.5 V SMT SPI Bus Serial EEPROM - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip 25AA256T-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Statut du produit:
Microchip 25AA256T-I/SN - Caractéristiques techniques
| Memory Density: | 256kb |
| Memory Organization: | 32 K x 8 |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Clock Frequency-Max: | 10MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The 25AA256T-I/SN is a Part of 24AA256 Series with 1.8 to 5.5 V 256 Kb SPI Bus Serial EEPROM available in Surface mount SOIC-8 Package.
Features:
- Max. clock 10 MHz
- Low-power CMOS technology:
- Max. Write Current: 5 mA at 5.5V, 10 MHz
- Read Current: 6 mA at 5.5V, 10 MHz
- Standby Current: 1 μA at 5.5V
- 32,768 x 8-bit organization
- 64 byte page
- Self-timed erase and write cycles (5 ms max.)
- Block write protection:
- Protect none, 1/4, 1/2 or all of array
- Built-in write protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
- Sequential read
- High reliability:
- Endurance: 1,000,000 erase/write cycles
- Data retention: > 200 years
- ESD protection: > 4000V
- Temperature ranges
- Industrial(I) : -40 to 85°C
- Automotive(E) -40 to 125°C
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount