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Manufacturer Part #
R7FA6E10F2CFP#AA0
RA6E1 Series 1 MB Flash 256 kB RAM 200 MHz 32-Bit Microcontroller - LQFP-100
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| Mfr. Name: | Renesas | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1 per Tray Package Style:LQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Renesas R7FA6E10F2CFP#AA0 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Applicable products: RA RX family LQFP/LFQFP productsThe back-end factory: Renesas Electronics Corporation Beijing Factory (“Beijing”)Changes: The die-bond material will be changed.The new die-bond material is a proven one for mass production at “Beijing”Reason for Change: To ensure a stable supply.
Description of Change:Renesas will add full tray packaging to MCU products in addition to fractional and full carton.The standard shipping packaging using Renesas trays is a full carton (complete packaging). However, if the customer's order quantity is less than a full carton, we will change it to the full tray that will be added this time.Renesas plan to discontinue production of fractional tray packaging in the future.Regarding full tray production lot management, up to three production lots may be combined.Reason for Change:Stable supply of products, environmentally friendly response (improving packaging resource usage efficiency, reducing waste amount)
Description of Change:Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Full Carton shipment will be standard and combine maximum 3 production lots at worst case. Booking Part Number and Order quantity will be changed.Reason for Change: To secure a stable product supply and environment friendly strengthening (Improvement of efficiency in use of packaging resources, reduction of waste)
The purpose of this notification is to communicate a product change of select Renesas Electronics America, Inc. (REA) devices. This notification announces the addition of full carton part numbers for select MCU & SOC devices. Full carton shipments will be standard and combine a maximum of 3 production lots. See the appendix for additional details. The full carton shipments will have a new part number. There is no impact to the specifications, fit, form, characteristics, quality & reliability of the products.
The purpose of this notification is to communicate a product change of select Renesas Electronics America, Inc. (REA) devices. This notification announces the addition of full carton part numbers for select MCU & SOC devices. Full carton shipments will be standard and combine a maximum of 3 production lots. See the appendix for additional details. The full carton shipments will have a new part number. There is no impact to the specifications, fit, form, characteristics, quality & reliability of the products.
Subject: MCU/SOC products announcement of Full Carton.Description of Change:Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Full Carton shipment will be standard and combine maximum 3 production lots at worst case. Booking Part Number and Order quantity will be changed.
Part Status:
Renesas R7FA6E10F2CFP#AA0 - Technical Attributes
| Family Name: | RA6E1 |
| Core Processor: | ARM Cortex M33 |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 1MB |
| RAM Size: | 256kB |
| Speed: | 200MHz |
| Supply Voltage: | 2.7V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| Package Style: | LQFP-100 |
| Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
1 per Tray
Package Style:
LQFP-100
Mounting Method:
Surface Mount
