Murata — Wi-Fi^® + Bluetooth^® Modules

LBES5PL2EL

Chipset: NXP IW612

Type 2EL is a small and very high performance module based on NXP IW612 combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac/ax + Bluetooth® 5.3 BR/EDR/LE + 802.15.4 up to 601Mbps PHY data rate on Wi-fi® and 2Mbps PHY data rate on Bluetooth®. The WLAN section supports SDIO v3.0 DDR50 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data.

LBEE5ZZ2XS-846 (2XS)

Chipset: NXP 88W9098

Murata’s Type 2XS is a small and very high performance module based on NXP 88W9098 combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac/ax 2×2 MU-MIMO + Bluetooth® 5.3 BR/EDR/LE 2MPHY up to 1200Mbps PHY data rate on Wi-Fi® and 3Mbps PHY data rate on Bluetooth®. Type 2XS module has shared antenna for Wi-Fi and Bluetooth.

LBEE5XV2BZ-883 (2BZ)

Chipset: Infineon CYW54590

Murata’s Type 2BZ is a small and very high-performance module based on Infineon CYW54590 combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac 2×2 MIMO + Bluetooth® 5.2 BR/EDR/LE up to 866Mbps PHY data rate on Wi-Fi® and 3Mbps PHY data rate on Bluetooth®. The WLAN section supports SDIO v3.0 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data.

CMWC1ZZABR-107

Type ABR is a small module (integrated PCB antenna) based on NXP 88MW320 (wireless microcontroller), supporting Wi-Fi® 802.11 b/g/n up to 72.2 Mbps PHY data rate; with an integrated 200MHz ARM Cortex-M4F MCU for host-side applications.

LBWA0ZZ2DS-688

Type 2DS is a small high-performance module (integrated PCB antenna) based on NXP 88W8801 chipset which supports Wi-Fi® 802.11b/g/n up to 72.2 Mbps PHY data rate. The WLAN interface supports SDIO 2.0.

LBEE5CJ1XK-687

Type 1XK is a small and high performance module based on NXP IW416 combo chipset which supports Wi-Fi® 802.11a/b/g/n + Bluetooth® 5.2 BR/EDR/LE up to 150 Mbps PHY data rate on Wi-Fi® and 3Mbps PHY data rate on Bluetooth®.

LBEE5QD1ZM-572

Type 1ZM is a small and very high performance module based on NXP 88W8987 combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac + Bluetooth® 5.1 BR/EDR/LE up to 433Mbps PHY data rate on Wi-Fi® and 3Mbps PHY data rate on Bluetooth®. The WLAN section supports SDIO 3.0 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data.

LBEE5XV1YM-574

Type 1YM is a small and very high performance module based on NXP 88W8997 combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac 2x2 MU-MIMO + Bluetooth® 5.2 BR/EDR/LE up to 866Mbps PHY data rate on Wi-Fi® and 3Mbps PHY data rate on Bluetooth®. The WLAN section supports PCIe v3.0 Gen 1/Gen 2 rate (2.5/5 Gbps), and SDIO 3.0 interfaces. The Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data.

LBEE5ZZ1XL-774

Type 1XL is a small and very high performance module based on NXP 88W9098 combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac/ax 2×2 MU-MIMO + Bluetooth® 5.3 BR/EDR/LE 2MPHY up to 1200Mbps PHY data rate on Wi-Fi® and 3Mbps PHY data rate on Bluetooth®. Type 1XL module has independent antenna for Bluetooth.

LBEE5KL1DX-883

This specification is applied to the IEEE802.11b/g/n WLAN + Bluetooth^® v5.1 (BR/EDR/BLE) module.

LBEE5KL1YN-814

Type 1YN is a small and high performance module based on Infineon CYW43439 combo chipset which supports Wi-Fi® 802.11b/g/n + Bluetooth® 5.2 BR/EDR/LE up to 65Mbps PHY data rate on Wi-fi® and 3Mbps PHY data rate on Bluetooth®. The WLAN section supports SDIO 2.0 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data.

LBEE59B1LV-278

Type 1LV is a small and high performance module based on Infineon CYW43012 combo chipset which supports Wi-Fi® 802.11a/b/g/n + Bluetooth® 5.0 BR/EDR/LE up to 72.2Mbps PHY data rate on Wi-fi® and 3Mbps PHY data rate on Bluetooth®. 2Mbps LE PHY is also supported. The WLAN section supports SDIO 3.0 DDR40 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data.

LBEE5HY1MW-230

This specification is applied to the IEEE802.11a/b/g/n/ac W-LAN + Bluetooth 5.0 combo module.

LBEE5PK2AE-564

Type 2AE is a small and very high performance module based on Infineon CYW4373E combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac + Bluetooth® 5.2 BR/EDR/LE up to 433Mbps PHY data rate on Wi-fi® and 3Mbps PHY data rate on Bluetooth®. The WLAN section supports SDIO 3.0 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data. Both WLAN and Bluetooth® section support USB2.0 interface too.

LBEE5XV1XA-540

Type 1XA is a small and very high-performance module based on Infineon CYW54591 combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac 2×2 MIMO RSDB + Bluetooth® 5.2 BR/EDR/LE up to 866Mbps PHY data rate on Wi-Fi® and 3Mbps PHY data rate on Bluetooth®. The WLAN section supports PCIe v3.0 Gen 1 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data.

LBWA1UZ1GC-958

Type 1GC is a small and high performance module based on Infineon CYW43907 chipset which support Wi-Fi® 802.11a/b/g/n up to 150Mbps PHY data rate and Ethernet up to 100Mbps PHY data rate, plus integrated powerful 320MHz ARM Cortex-R4 MCU for host-side applications.

LBEE5PA1LD-005

Type 1LD is a small module based on CYW43438 combo chipset + STM32F412 MCU, which support Wi-Fi® 802.11b/g/n + Bluetooth® 4.2 up to 65Mbps PHY data rate on Wi-Fi®, 3Mbps PHY data rate on Bluetooth® and integrated 100MHz ARM Cortex-M4 MCU for host-side applications.