text.skipToContent text.skipToNavigation
Infineon

 

Infineon 1200 V CoolSiC™ MOSFET Gen 2

Builds on the strengths of Generation 1 technology

Infineon's 1200 V silicon carbide (SiC) CoolSiC MOSFETs are built on a state-of-the-art trench semiconductor process optimized to allow for both the lowest losses in an application and the highest reliability in operation. This whole discrete CoolSiC MOSFET portfolio comes in 650 V, 750 V, 1200 V, 1700 V, and 2000 V voltage classes, with on-resistance ratings from 7 mΩ up to 1000 mΩ.

The 2nd generation of the CoolSiC 1200 V family by Infineon comes in a D²PAK-7L (TO-263-7) package for industrial applications. It builds on the strengths of Generation 1 technology with significant improvements in key figures-of-merit for both hard-switching operation and soft-switching topologies, suitable for all common combinations of AC/DC, DC/DC, and DC/AC stages.

CoolSiC™

CoolSiC trench technology enables a flexible parameter set to implement application-specific features in respective product portfolios, e.g., gate-source voltages, avalanche specification, short-circuit capability, or internal body diode rated for hard commutation.

Reference Design

The REF-DR3KIMBGSIC2MA SiC reference design consists of two PCBs, including a driver circuit and a 3-phase inverter for servo motors and drives. Benefits include high power density, passive cooling without cooling fans, and an ultra-small footprint with a PCB diameter of only 110 mm.

Comparison of CoolSiC G2 to G1

  • Improved chip performance: 5% to 20% lower power losses over typical load use cases
  • Improved .XT package interconnect: 12% better thermal resistance, Rth(j-c)
  • Excellent RDS(on) and a granular portfolio: 8 mΩ in G2 compared to 30 mΩ in G1, 12 products enable the optimal product choice

 

  • Overload operation up to Tvj = 200 and avalanche robustness in G2
  • Maximum RDS(on) at high temperature in G2
  • Robust short-circuit rating: 2 µs
  • Enlarged maximum gate-source voltage: -10 V to +23 V
  • High reliability: Maintaining G1 proven level, very low DPM rates

Features and Benefits

  • Highest efficiency for reduced cooling effort
  • Longer lifetime and higher reliability
  • Higher frequency operation
  • Reduction in system cost
  • Increased power density
  • Reduced system complexity
  • Ease of design and implementation

Applications

  • Servers
  • Telecom
  • Motor drives
  • On-board chargers/PFC
  • Auxiliary inverters
  • UPS
  • Energy storage systems/solar
  • Fast EV charging
  • SMPS

 

Resources

Infineon CoolSiC™ 1200 V MOSFETs