Manufacturer Part #
MCP4632T-503E/MF
Digital Potentiometer ICs Dual 7B V I2C Rheo
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel | ||||||||||
| Date Code: | |||||||||||
Microchip MCP4632T-503E/MF - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of MMT as an additional assembly site for selected MCP4232xx, MCP4242xx, MCP4262xx, MCP4252xx, MCP4632xx, MCP4642xx, MCP4652xx, MCP4662xx, MCP7383xx, MCP3423xx, and MCP3427xx device families available in 10L DFN (3x3x0.9mm) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:April 2023
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change:Qualification of UTL3 as an additional assembly site for selected MCP42xx, MCP46xx, MCP738xx and MCP34xx device families available in 10L DFN (3x3x0.9mm) package.Impacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve manufacturability and productivity by qualifying UTL3 as an additional assembly site.Change Implementation Status:In Progress Estimated First Ship Date:March 30, 2022 (date code: 2214)
PCN Status: Initial notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of UTL3 as an additional assembly site for selected MCP42xx, MCP46xx, MCP738xx and MCP34xx device families available in 10L DFN (3x3x0.9mm) package.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve manufacturability and productivity by qualifying UTL3 as an additional assembly siteChange Implementation Status: In ProgressEstimated Qualification Completion Date:January 2022
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
Available Packaging
Package Qty:
3300 per Reel