Manufacturer Part #
EX256-TQG100
EX256 Series 512 LUTs 81 I/O 2.7V Surface Mount FPGA - TQFP-100
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:90 per | ||||||||||
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Microchip EX256-TQG100 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Release of updated Synplify Pro ME version S-2021.09M-SP2 FPGA synthesis software bundled with Libero SoC v2022.3Reason for Change:Release updated Synplify Pro ME version S-2021.09M-SP2 FPGA synthesis software bundled with Libero SoC v2022.3 to prevent incorrect Verilog mapping of RTL using increment/decrement operations (++ / --) while indexing into an array on the right-hand side (RHS) of an assignment statement, as described in the attached Customer Notice.
Description of Change:Release of updated Synplify Pro ME version S-2021.09M-SP2 synthesis software bundled with Libero SoC v2022.3 as described in the attached customer notification details.Reason for Change:Release updated Synplify Pro ME version S-2021.09M-SP2 synthesis software bundled with Libero SoC v2022.3 to prevent incorrect VHDL expression evaluation during compilation, when performing subtraction with a real constant number operand, and an additional division/multiplication operation that uses a variable. This is to fix a VHDL compiler issue that occurs in specific VHDL expressions.
PCN Status: Final notification.PCN Type:Manufacturing ChangeDescription of Change:Qualification of G631HQ mold compound material for selected Microsemi products available in 100L, 144L LQFP and 80L, 100L, and 128L TQFP packages at ANAP assembly site.Impacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve productivity by qualifying G631HQ molding compound material. Assembly house will discontinue the mold compound materials identified in the pre-change.Change Implementation Status:In ProgressEstimated First Ship Date:November 29, 2021 (date code: 2149)
Part Status:
Available Packaging
Package Qty:
90 per