
Manufacturer Part #
PIC16C54C-04I/SO
PIC16C Series 768 B Flash 25 B SRAM SMT 8-Bit Microcontroller - SOIC-18
Microchip PIC16C54C-04I/SO - Product Specification
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Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC.Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Part Status:
Microchip PIC16C54C-04I/SO - Technical Attributes
Family Name: | PIC16C |
Core Processor: | PIC |
Program Memory Type: | OTP |
Flash Size (Bytes): | 768B |
RAM Size: | 25B |
Speed: | 4MHz |
No of I/O Lines: | 12 |
Peripherals: | Watchdog |
Number Of Timers: | 1 |
Supply Voltage: | 2.5V to 5.5V |
Operating Temperature: | -40°C to +85°C |
Watchdog Timers: | 1 |
Package Style: | SOIC-18 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
42 per Tube
Package Style:
SOIC-18
Mounting Method:
Surface Mount