
Manufacturer Part #
AVR64EA48-I/PT
AVR 8-Bit 20MHz 64KB (64K x 8) FLASH 48-TQFP (7x7)
Microchip AVR64EA48-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AVR64EA48, AVR32EA48, AVR16EA48, ATMEGA3209, ATMEGA4809, ATMEGA809 and ATMEGA1609 device families available in 48L TQFP (7x7x1mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:15 January 2025 (date code: 253)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AVR64EA48, AVR32EA48, AVR16EA48, ATMEGA3209, ATMEGA4809, ATMEGA809 and ATMEGA1609 device families available in 48L TQFP (7x7x1mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.
Microchip has released a new Document for the AVR64EA28/32/48 Silicon Errata and Data Sheet Clarifications of devices.Description of Change:Updated Silicon Revision: B2Added errata:• Device: 2.2.3. Write Operation Lost if Consecutive Writes to Specific Address SpacesAdded Data Sheet Clarifications:• SPI:– 3.1. SPI - Serial Peripheral Interface– 3.2. SPI - Serial Peripheral Interface• Electrical Characteristics:– 3.5. Electrical Characteristics - I/O Pins– 3.7. Electrical Characteristics - SPIReason for Change: To Improve Productivity
Microchip has released a new Document for the AVR64EA28/32/48 Silicon Errata and Data Sheet Clarifications of devices.Description of Change:Added Silicon Revision: B2 Added errata:• Device: 2.2.4. Limitation on Flash Boot Size and Flash Code Size Fuses Added Data Sheet Clarifications:• Electrical Characteristics: 3.1. Electrical Characteristics - Supply Voltage• Electrical Characteristics: 3.2. Electrical Characteristics - Peripherals Power Consumption• Electrical Characteristics: 3.4. Electrical Characteristics - AC
Microchip has released a new Errata for the AVR64EA28/32/48 Silicon Errata and Data Sheet Clarifications of devices.Description of Change:Added errata:• 2.2.3. Write Operation Lost if Consecutive Writes to Specific Address Spaces• 2.4.2. Flash-Self Programming Failing When Flash Read During ProgrammingRemoved errata:• NVMCTRL: Flash Page Erase/Write Operation Non-FunctionalReason for Change: To Improve Productivity
Microchip has released a new Errata for the AVR32EA28/32/48 Silicon Errata and Data Sheet Clarifications of devices. Notification Status: FinalDescription of Change: Initial document releaseImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 15 May 2023
Part Status:
Microchip AVR64EA48-I/PT - Technical Attributes
Family Name: | AVR EA |
Core Processor: | AVR |
Program Memory Type: | Flash |
Flash Size (Bytes): | 64kB |
RAM Size: | 6kB |
Speed: | 20MHz |
No of I/O Lines: | 41 |
InterfaceType / Connectivity: | I2C/SPI/USART |
Peripherals: | Brown-out Detect/POR/PWM |
Number Of Timers: | 6 |
Supply Voltage: | 1.8V to 5.5V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 28-chx12-bit |
On-Chip DAC: | 1-chx10-bit |
Watchdog Timers: | 1 |
Package Style: | TQFP-48 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
250 per Tray
Package Style:
TQFP-48
Mounting Method:
Surface Mount