

Manufacturer Part #
R5F566TAADFP#30
32BIT MCU RX66T FL-256K LQFP-100
Renesas R5F566TAADFP#30 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Applicable products: RA RX family LQFP/LFQFP productsThe back-end factory: Renesas Electronics Corporation Beijing Factory (?Beijing?)Changes: The die-bond material will be changed.The new die-bond material is a proven one for mass production at ?Beijing?Reason for Change: To ensure a stable supply.
Description of Change:Renesas will add full tray packaging to MCU products in addition to fractional and full carton.The standard shipping packaging using Renesas trays is a full carton (complete packaging). However, if the customer's order quantity is less than a full carton, we will change it to the full tray that will be added this time.Renesas plan to discontinue production of fractional tray packaging in the future.Regarding full tray production lot management, up to three production lots may be combined.Reason for Change:Stable supply of products, environmentally friendly response (improving packaging resource usage efficiency, reducing waste amount)
Part Status:
Available Packaging
Package Qty:
90 per Tray