Manufacturer Part #
25AA020AT-I/OT
EEPROM 2K 256X8 1.8V SER EE IND
Microchip 25AA020AT-I/OT - Product Specification
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Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 93LCxxx, 93AAxxx, 93Cxxx, PIC10F2xx, 25LC0xxx, 25AA0xxx, MTCH101,24VL0xx, 24LC0xx, 24AA0xxx, 24C01C, 34VL02, 34LC02, 34AA02, MCP40xx, MCP9800xx, MCP9802xx, MCP738xx, MCP950xx, MCP6Vxxx, and MCP64xx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Product Documents for the 25AA020A/25LC020A 2-Kbit SPI Bus Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change:1. Added Product Identification System section for Automotive; Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings; Removed X-rotated TSSOP package offerings; Replaced terminology �Master� and �Slave� with �Host� and �Client�, respectively; Replaced �Automotive (E):� designation with �Extended (E):� designation; Reformatted some sections for better readability.Impacts to Data Sheet: See above detailsReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 06 January 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
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Microchip 25AA020AT-I/OT - Technical Attributes
Memory Density: | 2kb |
Memory Organization: | 256 x 8 |
Supply Voltage-Nom: | 1.8V to 5.5V |
Clock Frequency-Max: | 10MHz |
Write Cycle Time-Max (tWC): | 5ms |
Package Style: | SOT-23-6 (SOT-26) |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-6 (SOT-26)
Mounting Method:
Surface Mount