Manufacturer Part #
11AA040-I/SN
11AA040 Series 4 Kbit (512 x 8) 5.5 V SMT UNI/O® Serial EEPROM - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Std. Mfr. Pkg Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip 11AA040-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Datasheet for the 11AAXXX-1-Kbit to 16-Kbit UNI/O Serial EEPROM Family Data Sheet of devices. Description of Change:Updated formatting to current template; Replaced terminology �Master� and �Slave� with �Host� and �Client� respectively; Added Automotive PISReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 21 March 2023
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Part Status:
Microchip 11AA040-I/SN - Technical Attributes
| Memory Density: | 4kb |
| Memory Organization: | 512 x 8 |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Clock Frequency-Max: | 100kHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The 11AAXXX/11LCXXX (11XX*) devices are a family of 1 Kbit through 16 Kbit Serial Electrically Erasable PROMs. The devices are organized in blocks of x8-bit memory and support the patented** single I/O UNI/O® serial bus. By using Manchester encoding techniques, the clock and data are combined into a single, serial bit stream (SCIO), where the clock signal is extracted by the receiver to correctly decode the timing and value of each bit.
Low-voltage design permits operation down to 1.8 V (for 11AAXXX devices), with standby and active currents of only 1 uA and 1 mA, respectively. The 11XX family is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 3-lead SOT-23, 3-lead TO-92, 8-lead TDFN, and 8-lead MSOP
Features:
- Single I/O Interface
- 4 Kbit Memory Density
- 1.8-5.5 V Operating Voltage
- 10-100 kHz Operating Frequency
- 1 Million Erase/Write Cycles
- Software Write Protect: ¼, ½, or Full Array
- Status Register
- Set/Erase entire memory with a single command
- ESD Protection > 4 kV
- Noise Filtration Circuitry
Available Packaging
Package Qty:
100 per Std. Mfr. Pkg
Package Style:
SOIC-8
Mounting Method:
Surface Mount