Manufacturer Part #
93LC86T-I/SN
93LC86 Series 16 Kbit (2 K x 8 / 1 K x 16) 6 V Microwire Serial EEPROM - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2139 | ||||||||||
Microchip 93LC86T-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Part Status:
Microchip 93LC86T-I/SN - Technical Attributes
| Memory Density: | 16kb |
| Memory Organization: | 2 K x 8 / 1 K x 16 |
| Supply Voltage-Nom: | 2.5V to 6V |
| Clock Frequency-Max: | 2MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The 93LC86 series of 8 K and 16 K low voltage serial Electrically Erasable PROM is configured as x8 or x16 bits depending on the ORG pin setup.
Advanced CMOS technology makes these devices ideal for low power nonvolatile memory applications. These devices also have a Program Enable (PE) pin to allow the user to write-protect the entire contents of the memory array. The 93LC76/86 is available in standard 8-pin PDIP and 8-pin surface mount SOIC packages.
Features:
- Single supply with programming operation down to 2.5 V
- Low-power CMOS technology
- 1 mA active current typical
- 5 μA standby current (typical) at 3.0 V
- ORG pin selectable memory configuration
- 1024 x 8 or 512 x 16 bit organization (93LC76)
- 2048 x 8 or 1024 x 16 bit organization (93LC86)
- Self-timed erase and write cycles (including auto-erase)
- Automatic ERAL before WRAL
- Power on/off data protection circuitry
- Industry standard 3-wire serial I/O
- Device status signal during erase/write cycles
- Sequential read function
- 1,000,000 erase/write cycles ensured
- Data retention > 200 years
- 8-pin PDIP/SOIC package
- Temperature ranges available
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount