Manufacturer Part #
93LC86C-I/SN
93LC86 Series 16 Kb (2K x 8/1K x 16) Microwire Compatible Serial EEPROM - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2406 | ||||||||||
Microchip 93LC86C-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Part Status:
Microchip 93LC86C-I/SN - Technical Attributes
| Memory Density: | 16kb |
| Memory Organization: | 2 K x 8 / 1 K x 16 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 3MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The 93LC86C-I/SN is a 16 Kbit (2K x 8 / 1K x 16) Microwire Compatible Serial EEPROM with advanced lowpower CMOS technology, available in surface mount SOIC-8 package.
The advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications.
Features:
- Low-power CMOS technology
- ORG pin to select word size for ‘86C version
- 2048 x 8-bit organization ‘A’ ver. devices (no ORG)
- 1024 x 16-bit organization ‘B’ ver. devices (no ORG)
- Program Enable Pin to Write-Protect the Entire Array (‘86C’ version only)
- Self-Timed Erase/Write Cycles (including Auto-Erase)
- Automatic ERAL before WRAL
- Power on/off data protection circuitry
- Industry standard 3-wire serial I/O
- Device Status signal (READY/BUSY)
- Sequential READ function
- 1,000,000 E/W cycles
- Data retention > 200 years
- Temperature ranges supported:
- Industrial (I) -40°C to +85°C
- Automotive (E) -40°C to +125°C
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Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount