Manufacturer Part #
93C46BT/SN
93C46 Series 1 Kbit (64 x 16) 5.5 V Microwire Compatible Serial EEPROM - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2042 | ||||||||||
Microchip 93C46BT/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Part Status:
Microchip 93C46BT/SN - Technical Attributes
| Memory Density: | 1kb |
| Memory Organization: | 64 x 16 |
| Supply Voltage-Nom: | 4.5V to 5.5V |
| Clock Frequency-Max: | 2MHz |
| Write Cycle Time-Max (tWC): | 6ms |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
This device provides dedicated 16-bit communication with advanced CMOS technology and makes device ideal for low power, nonvolatile memory application.
Features:
- Low-Power CMOS Technology
- 64 x 16-bit Organization ‘B’ Devices (no ORG)
- Self-Timed Erase/Write Cycles (including Auto-Erase)
- Automatic Erase All (ERAL) Before Write All (WRAL)
- Power-On/Off Data Protection Circuitry
- Industry Standard 3-Wire Serial I/O
- Device Status Signal (Ready/Busy)
- Sequential Read Function
- 1,000,000 Erase/Write Cycles
- Data Retention > 200 Years
- Pb-free and RoHS Compliant
Available Packaging
Package Qty:
3300 per
Package Style:
SOIC-8
Mounting Method:
Surface Mount