
Manufacturer Part #
24AA02E48T-I/OT
24AA02 Series 2 Kbit (256 x 8) 5.5 V Surface Mount I2C Serial EEPROM - SOT-23-5
Microchip 24AA02E48T-I/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
***FPCN108989 UPDATE***Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Revision History: November 18, 2024: Issued initial notification.January 27, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated firstship date to be on February 28, 2025.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach materialand CuPdAu as a new wire material
Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach material and CuPdAu as a new wire material
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:August 20, 2024 (date code: 2434)
Microchip has released a new Datasheet for the 2-Kbit I2C Serial EEPROMs with EUI-48 or EUI-64 Node Identity of devices. Notification Status: FinalDescription of Change:Added automotive product offering; Updated SOT-23 package drawings.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 02 Sep 2023
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Datasheet for the 24AA02E48/24AA025E48/24AA02E64/24AA025E64 2-Kbit I2C Serial EEPROMs with EUI-48? or EUI-64? Node Identity Data Sheet of devices. Description of Change:Updated SOIC and SOT-23 package drawings; Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client?, respectively; Replaced ?Automotive (E):?designation with ?Extended (E):? designation; Reformatted some sections for better readability.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 20 Sep 2022
Part Status:
Microchip 24AA02E48T-I/OT - Technical Attributes
Memory Density: | 2kb |
Memory Organization: | 256 x 8 |
Supply Voltage-Nom: | 1.7V to 5.5V |
Clock Frequency-Max: | 400kHz |
Write Cycle Time-Max (tWC): | 5ms |
Data Retention: | 200 yr |
Interface Type: | I2C |
Access Time-Max: | 900ns |
Operating Temp Range: | -40°C to +85°C |
No of Terminals: | 5 |
Package Style: | SOT-23-5 (SOT-25) |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount