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Référence fabricant
D0811PM2FDGUKW-U
D0811PM2x Series 8Gb (512M x 16) 1600 MHz Mobile LPDDR4 Memory IC - FBGA-200
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| Nom du fabricant: | Kingston | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :144 par Tray Style d'emballage :FBGA-200 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2346 | ||||||||||
Kingston D0811PM2FDGUKW-U - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Change Descrip;on:Kingston’s LPDDR4/x devices based on Micron’s Z21M 8Gb die are now End of Life (EOL). Due to limited foundry support for the Micron Z21M die, future support for Z21M based devices would be discontinued.LTB :10/1/2025LTS : 1/1/2026Notes(1) All LTB orders are NCNR.(2) An increase in demand may cause the LTB date to be pulled in. Please contact your Kingston representative to forecast and to assist with replacement part sampling.(3) A mutually agreed upon forecast between Kingston and the customer for the LTB quantity is needed 3 months prior to the LTB date to secure LTB quantity.(4) LTB availability is on a first-come, first-served basis.
Statut du produit:
Kingston D0811PM2FDGUKW-U - Caractéristiques techniques
| Memory Type: | SDRAM |
| Memory Density: | 8Gb |
| Configuration: | 512M x 16 |
| Supply Voltage-Nom: | 1.06V to 1.95V |
| Number of Words: | 512M |
| Word Length: | 16b |
| Access Time-Max: | 3.5ns |
| Interface Type: | LPDDR4 |
| Operating Temp Range: | -40°C to +95°C |
| Storage Temperature Range: | -55°C to +125°C |
| Style d'emballage : | FBGA-200 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
144 par Tray
Style d'emballage :
FBGA-200
Méthode de montage :
Surface Mount
