
Manufacturer Part #
MSC090SMA070B
700 V 28 A Through Hole Silicon Carbide N-Channel Power MOSFET - TO247-3
Microchip MSC090SMA070B - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Implement packing material changes for selected PSDS and SIC products available in SOT-227, TO-220, TO-247, TO-263 and TO-268 packages at FSTS and TEAM final test sites.Reason for Change:To improve productivity by implementing packing material changes for selected PSDS and SIC products.
Description of Change:Qualification of ASEW as an additional assembly site for MSC035SMA170B, MSC090SMA070B, MSC015SMA070B, MSC017SMA120B, MSC060SMA070B, MSC750SMA170B, MSC180SMA120B, MSC040SMA120B, MSC080SMA120B, MSC035SMA070B, MSC025SMA120B and MSC360SMA120B catalog part numbers (CPN) available in 3L TO-247 package.Reason for Change:To improve on time delivery performance by qualifying ASEW as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 17, 2025 (date code: 2503)
***June 27, 2024: Re-issued final notification. Updated the affected parts list to include CPN MSC035SMA070BV01 based on the updated scope***Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Revision History:May 12, 2023: Issued initial notification.May 28, 2024: Issued cancellation notificationDescription of Change:This qualification was originally performed to qualify Microchip Technology Colorado – Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.Reason for Change:Microchip has decided to not qualify Microchip Technology Colorado – Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.
Revision History:February 26, 2024: Issued initial notification.May 24, 2024: Issued final notification. Revised the affected parts list. Provided estimated first ship date to be on June 29, 2024.Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:• Document migrated from Microsemi template to Microchip template; Assigned Microchip literature number DS-00005366A, which replaces the previous Microsemi literature number 050-7756.• Updated values in Table 1-1, Table 1-4, and Table 1-5.• Updated values for RDS(on), VGS(th), and IDSS in Table 1-3.• Updated 1.3. Typical Performance Curves and 2.1. Package Outline Drawing.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 30 Apr 2024NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Microchip MSC090SMA070B - Technical Attributes
Technology: | SiCFET (Silicon Carbide) |
Product Status: | Active |
Fet Type: | N-Ch |
No. of Channels: | 1 |
Drain-to-Source Voltage [Vdss]: | 700V |
Drain Current: | 28A |
Input Capacitance: | 785pF |
Power Dissipation: | 90W |
Operating Temp Range: | -55°C to +175°C |
Package Style: | TO-247-3 |
Mounting Method: | Through Hole |
Available Packaging
Package Qty:
30 per Tube
Package Style:
TO-247-3
Mounting Method:
Through Hole