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Manufacturer Part #
MSC060SMA070B4
700V 39A Through Hole Silicon Carbide N-Channel Power MOSFET - TO247-4
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:30 per Tube Package Style:TO-247-4 Mounting Method:Through Hole | ||||||||||
| Date Code: | 2145 | ||||||||||
Microchip MSC060SMA070B4 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Implement packing material changes for selected PSDS and SIC products available in SOT-227, TO-220, TO-247, TO-263 and TO-268 packages at FSTS and TEAM final test sites.Reason for Change:To improve productivity by implementing packing material changes for selected PSDS and SIC products.
Microchip has released a new Datasheet for the MSC060SMA070B4 700V, 60 mOhm mSiC™ MOSFET TO-247-4 Datasheet of devices.Notification Status: FinalDescription of Change:• Document migrated from Microsemi template to Microchip template; Assigned Microchip literature number DS-00005360A, which replaces the previous Microsemi literature number 050-7762.• Updated values in Table 1-1, Table 1-4, and Table 1-5.• Updated values for RDS(on), VGS(th), and IDSS in Table 1-3.• Added tM symbol for mounting torque in Table 1-2.• Updated 1.3. Typical Performance Curves and 2.1. Package Outline Drawing.Impacts to Data Sheet: See above detailsReason for Change: To improve productivity.Change Implementation Status: CompleteDate Document Changes Effective: 15 Aug 2024
***June 27, 2024: Re-issued final notification. Updated the affected parts list to include CPN MSC035SMA070BV01 based on the updated scope***Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Revision History:May 12, 2023: Issued initial notification.May 28, 2024: Issued cancellation notificationDescription of Change:This qualification was originally performed to qualify Microchip Technology Colorado – Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.Reason for Change:Microchip has decided to not qualify Microchip Technology Colorado – Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.
Revision History:February 26, 2024: Issued initial notification.May 24, 2024: Issued final notification. Revised the affected parts list. Provided estimated first ship date to be on June 29, 2024.Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
SYST-29VUDG106Microchip has released a new Datasheet for the MSC060SMA070B 700V, 60 mOhm mSiC™ MOSFET TO-247 Datasheet of devices. If you are using one of these devices please read the document located at MSC060SMA070B 700V, 60 mOhm mSiC™ MOSFET TO-247 Datasheet.Notification Status: FinalDescription of Change:• Document migrated from Microsemi template to Microchip template; Assigned Microchip literature number DS-00005359A, which replaces the previous Microsemi literature number 050-7759.• Updated values in Table 1-1, Table 1-4, and Table 1-5.• Updated values for RDS(on), VGS(th), and IDSS in Table 1-3.• Updated 1.3. Typical Performance Curves and 2.1. Package Outline Drawing.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 30 Apr 2024NOTE: Please be advised that this is a change to the document only the product has not been changed.
Revision History:May 09, 2023: Issued initial notification.December 05, 2023: Re-issued initial notification to add MSC025SMA120D/S-C25, MSC017SMA120D/S-C25, MSC040SMA120D/S-C25, MSC080SMA120D/S-C25,MSC015SMA070D/S-C25, MSC060SMA070D/S-C25, MSC035SMA170D/S-C25 catalog part numbers (CPNs) in the affected parts list.Revision of Qual Report Availability and Final PCN Issue Date from “September 29, 2023” to “August 30, 2024”.Description of Change:Implementation of Die Overcoat material with Polyimide layer selected Microsemi SIC MOSFET product of MSCxxxSMA070, MSCxxxSMA120, and MSCxxxSMA170 devicefamilies in DICE, SOT-227, TO-247, TO-263 and TO-268 packages.Reason for Change:To improve productivity by implementing Die Overcoat (polyimide layer)
Part Status:
Microchip MSC060SMA070B4 - Technical Attributes
| Technology: | SiCFET (Silicon Carbide) |
| Product Status: | Active |
| Fet Type: | N-Ch |
| No. of Channels: | 1 |
| Drain-to-Source Voltage [Vdss]: | 700V |
| Drain Current: | 39A |
| Input Capacitance: | 1175pF |
| Power Dissipation: | 143W |
| Operating Temp Range: | -55°C to +175°C |
| Package Style: | TO-247-4 |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
30 per Tube
Package Style:
TO-247-4
Mounting Method:
Through Hole
