Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.
Please contact your salesperson for assistance.
Manufacturer Part #
MCP73833T-AMI/MF
Battery Management Charge Management Controllers
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:DFN-10 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP73833T-AMI/MF - Product Specification
Shipping Information:
ECCN:
PCN Information:
UPDATE on Future PCN95860Revision History:February 9, 2023: Issued initial notification.October 6, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 26, 2023.Description of Change:Qualification of MMT as an additional assembly site for selected MCP4232xx, MCP4242xx, MCP4262xx, MCP4252xx, MCP4632xx, MCP4642xx, MCP4652xx, MCP4662xx, MCP7383xx, MCP3423xx, and MCP3427xx device families available in 10L DFN (3x3x0.9mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve manufacturability and on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:November 26, 2023 (date code: 2348)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Description of Change:Qualification of MMT as an additional assembly site for selected MCP4232xx, MCP4242xx, MCP4262xx, MCP4252xx, MCP4632xx, MCP4642xx, MCP4652xx, MCP4662xx, MCP7383xx, MCP3423xx, and MCP3427xx device families available in 10L DFN (3x3x0.9mm) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:April 2023
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
Microchip MCP73833T-AMI/MF - Technical Attributes
| Configuration: | Linear |
| Number of Cells: | 1 |
| Supply Voltage: | 3.75V to 6V |
| Output Voltage: | 4.2V |
| Supply Current: | 2mA |
| Output Current: | 1000mA |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| No of Terminals: | 10 |
| Moisture Sensitivity Level: | 1 |
| Package Style: | DFN-10 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
DFN-10
Mounting Method:
Surface Mount