Manufacturer Part #
TEA1761T/N2/DG,118
BU 510 - SECURITY & CONNECTIVITY
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| Mfr. Name: | NXP | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2500 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2349 | ||||||||||
Product Specification Section
NXP TEA1761T/N2/DG,118 - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
N/A
File
Date
Part Status:
Active
Active
NXP TEA1761T/N2/DG,118 - Technical Attributes
Attributes Table
| Supply Current-Max: | 1.4mA |
| Supply Voltage-Max: | 38V |
| Topology: | Flyback |
| Power Dissipation: | 0.45W |
| Operating Temp Range: | -20°C to +150°C |
| Storage Temperature Range: | -55°C to +150°C |
| Output Current: | 12mA |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Pricing Section
Global Stock:
0
USA:
0
On Order:
0
Factory Lead Time:
18 Weeks
Quantity
Unit Price
2,500
$0.67
5,000+
$0.655
Product Variant Information section
Available Packaging
Package Qty:
2500 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount