Manufacturer Part #
MCP1630-E/MC
Microchip Technology Switching Controllers Hi Spd PWM
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:150 per Package Style:DFN-8 Mounting Method:Surface Mount | ||||||||||
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Microchip MCP1630-E/MC - Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Datasheet for the MCP1630/V Data Sheet of devicesNotification Status: FinalDescription of Change:1. Minor layout changes.2. Added automotive qualification to Features, Description and Product Identification System.3. Updated Section 6.0 �Packaging Information�.Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 25 Jul 2022
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
Microchip MCP1630-E/MC - Technical Attributes
| Supply Current-Max: | 2.8mA |
| Supply Voltage: | 3V to 5.5V |
| Input Voltage: | 3V to 5.5V |
| Topology: | Buck/Boost/Flyback |
| Duty Cycle-Max: | 0.99% |
| Operating Temp Range: | -40°C to +125°C |
| Storage Temperature Range: | -65°C to +125°C |
| Thermal Resistance: | 50.8°C/W |
| Package Style: | DFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
150 per
Package Style:
DFN-8
Mounting Method:
Surface Mount