Manufacturer Part #
MCP23S09T-E/MG
MCP23S09 Series SPI I/O EXPANDER - QFN-16
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:QFN-16 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP23S09T-E/MG - Product Specification
Shipping Information:
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PCN Information:
Microchip has released a new Datasheet for the MCP23009/MCP23S09 - 8-Bit I/O Expander with Open-Drain Outputs Data Sheet of devices.Description of Change:Added information about the Automotive Qualification status of the device in Section �Features�.Clarified Section 3.1 �Package Marking Information� to more closely match manufacturing standards.Updated Section �Product Identification System�, with Automotive Qualified devices.Minor text and format changes throughout.
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip MCP23S09T-E/MG - Technical Attributes
| Supply Current-Max: | 1mA |
| Supply Voltage-Max: | 5.5V |
| Operating Temp Range: | -40°C to +125°C |
| Package Style: | QFN-16 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
QFN-16
Mounting Method:
Surface Mount