Manufacturer Part #
MCP23S09T-E/MG
MCP23S09 Series SPI I/O EXPANDER - QFN-16
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:QFN-16 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2425 | ||||||||||
Microchip MCP23S09T-E/MG - Product Specification
Shipping Information:
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Microchip has released a new Datasheet for the MCP23009/MCP23S09 - 8-Bit I/O Expander with Open-Drain Outputs Data Sheet of devices.Description of Change:Added information about the Automotive Qualification status of the device in Section ?Features?.Clarified Section 3.1 ?Package Marking Information? to more closely match manufacturing standards.Updated Section ?Product Identification System?, with Automotive Qualified devices.Minor text and format changes throughout.
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip MCP23S09T-E/MG - Technical Attributes
| Supply Current-Max: | 1mA |
| Supply Voltage-Max: | 5.5V |
| Operating Temp Range: | -40°C to +125°C |
| Package Style: | QFN-16 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
QFN-16
Mounting Method:
Surface Mount