Manufacturer Part #
MCP6071-E/SN
MCP6071 Series 6 V 1.2 MHz Rail-to-Rail I/O Operational Amplifier - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6071-E/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Microchip has released a new Product Documents for the MCP6071 Family Data Sheet of devices.Notification Status: FinalDescription of Change:Added Markings table for TDF package option, in Section 6.1 �Package Marking Information�Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 07 Nov 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Microchip MCP6071-E/SN - Technical Attributes
| No of Channels: | 1 |
| Slew Rate-Nom: | 0.5V/µs |
| Input Offset Voltage-Max: | 150µV |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP6071 operational amplifier (op amps) has a low input offset voltage (±150 μV, maximum) and rail-to-rail input and output operation.
The MCP6071 is unity gain stable and has a gain bandwidth product of 1.2 MHz (typical). This device operates with a single supply voltage as low as 1.8 V, while drawing low quiescent current per amplifier (110 μA, typical). These features make the MCP6071 well suited for single-supply, high precision, battery-powered applicaitons. The MCP6071 is available is SOIC and 2x3 TDFN packages
Features:
- Low Offset Voltage: ±150 μV (maximum)
- Low Quiescent Current: 110 μA (typical)
- Rail-to-Rail Input and Output
- Wide Supply Voltage Range: 1.8 V to 6.0 V
- Gain Bandwidth Product: 1.2 MHz (typical)
- Unity Gain Stable
- Extended Temperature Range: -40°C to +125°C
- No Phase Reversal
Applications:
- Automotive
- Portable Instrumentation
- Sensor Conditioning
- Battery Powered Systems
- Medical Instrumentation
- Test Equipment
- Analog Filters
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount
