Manufacturer Part #
MCP6031-E/MC
MCP6031 Series 5.5 V 10 kHz Rail-to-Rail I/O Operational Amplifier - DFN-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:150 per Tube Package Style:DFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6031-E/MC - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change:Qualification of MMT as an additional assembly site for selected MCP6031, MCP6033, MCP6002, MCP6231 and MCP6241 device families available in 8L DFN (2x3x0.9mm) package.Impacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:October 01, 2021 (date code: 2140)
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
CCB 1474 Initial Notice: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Description of Change: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Pre Change: EFTEC-64T lead-framePost Change: EFTEC-64T or C194 lead-frameReason for Change: To improve on-time delivery performance by qualifying an additional lead frame materialNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip MCP6031-E/MC - Technical Attributes
| Amplifier Type: | Precision |
| No of Channels: | 1 |
| Slew Rate-Nom: | 4V/ms |
| Input Offset Voltage-Max: | 150µV |
| Gain Bandwidth Product: | 10kHz |
| Average Bias Current-Max: | 100pA |
| Supply Voltage: | 1.8V to 5.5V |
| Common Mode Rejection Ratio: | 95dB |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 88dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 115dB |
| Phase Margin: | 65° |
| Low Noise: | 165nV/√Hz |
| Output Current: | 23mA |
| Package Style: | DFN-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP6031-E/MC is a part of MCP6031 Series Operational Amplifier. It can sustain a standard temperature ranging from -40 to 125°C It comes in 8 pin DFN package.
The MCP6031 operational amplifier (op amp) has a gain bandwidth product of 10 MHz with a low typical operating current of 1.0 mA and an offset voltage that is less than 0.5 mV. It is available in standard 8-lead PDIP, SOIC and TSSOP packages. This amplifier is ideal for battery and loop-powered applications as well as industrial process control, low-power battery-operated devices, portable equipment, data acquisition equipment, test equipment and low-end audio applications.
Features:
- Rail-to-Rail Input and Output
- Low Offset Voltage: ±150 μV (maximum)
- Ultra Low Quiescent Current: 0.9 μA (typical)
- Wide Power Supply Voltage: 1.8 V to 5.5 V
- Gain Bandwidth Product: 10 kHz (typical)
- Unity Gain Stable
- Chip Select (CS) capability: MCP6033
- Extended Temperature Range:
- -40°C to +125°C
- No Phase Reversal
Application:
- Toll Booth Tags
- Wearable Products
- Battery Current Monitoring
- Sensor Conditioning
- Battery Powered
Available Packaging
Package Qty:
150 per Tube
Package Style:
DFN-8
Mounting Method:
Surface Mount
