Manufacturer Part #
MCP6022T-I/SN
MCP6022 Series 5.5 V 10 MHz Rail-to-Rail I/O Operational Amplifier - SOIC-8
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6022T-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Datasheet for the MCP6021/1R/2/3/4 - Rail-to-Rail Input/Output, 10 MHz Op Amps of devices. Notification Status: FinalDescription of Change: � Added Section �Product Identification System (Automotive)�.� Updated 6.0 �Packaging Information�Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 12 Apr 2023
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Part Status:
Microchip MCP6022T-I/SN - Technical Attributes
| Amplifier Type: | General Purpose |
| No of Channels: | 2 |
| Slew Rate-Nom: | 7V/µs |
| Input Offset Voltage-Max: | 500µV |
| Gain Bandwidth Product: | 10MHz |
| Average Bias Current-Max: | 150pA |
| Supply Voltage: | 2.5V to 5.5V |
| Common Mode Rejection Ratio: | 90dB |
| Supply Current: | 1mA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 90dB |
| Operating Temp Range: | -40°C to +85°C |
| DC Voltage Gain: | 110dB |
| Phase Margin: | 65° |
| Low Noise: | 8.7nV/√Hz |
| Output Current: | 30mA |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
Features:
- Rail-to-Rail Input/Output
- Wide Bandwidth: 10 MHz (typical)
- Low Noise: 8.7 nV/√Hz, at 10 kHz (typical)
- Low Offset Voltage:
- Industrial Temperature: ±500 μV (maximum)
- Extended Temperature: ±250 μV (maximum)
- Mid-Supply VREF: MCP6021 and MCP6023
- Low Supply Current: 1 mA (typical)
- Total Harmonic Distortion: 0.00053% (typical, G = 1 V/V)
- Unity Gain Stable
- Power Supply Range: 2.5 V to 5.5 V
- Temperature Range:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
Applications:
- Automotive
- Multi-Pole Active Filters
- Audio Processing
- DAC Buffer
- Test Equipment
- Medical Instrumentation
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount