Manufacturer Part #
MCP6002-E/SN
MCP6002 Series 6 V 1 MHz SMT Low-Power Operational Amplifier - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2334 | ||||||||||
Microchip MCP6002-E/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Part Status:
Microchip MCP6002-E/SN - Technical Attributes
| Amplifier Type: | Low Power |
| No of Channels: | 2 |
| Slew Rate-Nom: | 0.6V/µs |
| Input Offset Voltage-Max: | 4.5mV |
| Gain Bandwidth Product: | 1MHz |
| Average Bias Current-Max: | 1100pA |
| Supply Voltage: | 1.8V to 6V |
| Common Mode Rejection Ratio: | 76dB |
| Supply Current: | 100µA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 86dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 112dB |
| Phase Margin: | 90° |
| Low Noise: | 28nV/√Hz |
| Output Current: | 23mA |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP6002-E/SN is a operational amplifiers (op amps) is specifically designed for general-purpose applications. This family has a 1 MHz Gain Bandwidth Product (GBWP) and 90° phase margin (typ.). It also maintains 45° phase margin (typ.) with a 500 pF capacitive load.
This family operates from a single supply voltage as low as 1.8 V, while drawing 100 μA (typ.) quiescent current. Additionally, the MCP6001 supports rail-to-rail input and output swing, with a common mode input voltage range of VDD + 300 mV to VSS – 300 mV. This family of op amps is designed with Microchip’s
advanced CMOS process.
Features:
- Available in SC-70-5 and SOT-23-5 packages
- Gain Bandwidth Product: 1 MHz (typ.)
- Rail-to-Rail Input/Output
- Supply Voltage: 1.8 V to 5.5 V
- Supply Current: IQ = 100 μA (typ.)
- Phase Margin: 90° (typ.)
- Temperature Range:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
- Available in Single, Dual and Quad Packages
Applications:
- Automotive
- Portable Equipment
- Photodiode Amplifier
- Analog Filters
- Notebooks and PDAs
- Battery-Powered Systems
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount
