Manufacturer Part #
B04B-XASK-1(LF)(SN)
XA Series 4 Position 2.5 mm Pitch Top Entry Through Hole Shrouded Header
Product Specification Section
JST B04B-XASK-1(LF)(SN) - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
N/A
File
Date
Part Status:
Active
Active
JST B04B-XASK-1(LF)(SN) - Technical Attributes
Attributes Table
No of Positions: | 4 |
Pitch: | 2.5 mm |
Style/Orientation: | Straight Header/Plug |
Termination: | Crimp |
Operating Temp Range: | -25°C to +85°C |
Voltage Rating: | 250V |
Current Rating: | 3A |
Contact Plating: | Tin |
Material: | Polyamide |
No of Rows: | 1 |
Type: | Cable to Board |
Color: | Natural |
Insulation Resistance: | 1000MΩ |
Mounting Method: | Through Hole |
Features & Applications
The B04B-XASK-1(LF)(SN) is a Part of XA Series 4 Position 2.50 mm Pitch Wire-to-wire or wire to board crimp style connector.
Features:
- Secure locking device
- Interchangeable between crimp and IDC socket
- Secondary retainers
- Harness variation
Specification:
- Pitch: 2.0 mm
- Current rating: 3A (AWG#22)
- Voltage rating: 250 V
- PC board mounting direction: Top entry, Side entry
- Temperature range: - 25 °C to +85 °C
- Contact resistance: Initial value/10 mΩ max, After environmental testing/20 mΩ max
- Applicable wire: AWG #28 t0 #22
- Applicable PC board thickness: 1.6 mm
Pricing Section
Global Stock:
16,541
USA:
4,242
Germany (Online Only):
12,299
On Order:
0
Factory Lead Time:
16 Weeks
Quantity
Web Price
1
$0.151
250
$0.147
1,000
$0.141
2,500
$0.137
10,000+
$0.128
Product Variant Information section
Available Packaging
Package Qty:
400 per Bag
Mounting Method:
Through Hole