Manufacturer Part #
DILB28P-223TLF
28 Position (2 x 14 ) 2.54 mm Pitch Open Frame Through Hole DIP Socket
Product Specification Section
Amphenol Communications Solutions DILB28P-223TLF - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
N/A
File
Date
Part Status:
Active
Active
Amphenol Communications Solutions DILB28P-223TLF - Technical Attributes
Attributes Table
Type: | DIP Socket |
Style: | PCB Through Hole |
No of Pins: | 28 |
Termination Style/Mounting: | Solder |
Terminal Pitch: | 2.54mm |
Contact Material: | Copper Alloy |
Contact Plating: | Tin |
Rated Current: | 1A |
Material: | Polyamide |
Insulation Resistance: | 1000MΩ |
Operating Temp Range: | -55°C to +105°C |
No of Rows: | 2 |
Dielectric Withstanding Voltage: | 1000V |
Mounting Method: | Through Hole |
Pricing Section
Global Stock:
9,180
USA:
9,180
On Order:
0
Factory Lead Time:
9 Weeks
Quantity
Unit Price
1
$0.455
75
$0.445
200
$0.435
750
$0.42
2,000+
$0.405
Product Variant Information section
Available Packaging
Package Qty:
17 per Tube
Mounting Method:
Through Hole