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Manufacturer Part #

DILB16P-223TLF

16 Position (2 x 8 ) 2.54 mm Pitch Open Frame Through Hole DIP Socket

ECAD Model:
Mfr. Name: Amphenol Communications Solutions
Standard Pkg:
Product Variant Information section
Date Code: 2236
Product Specification Section
Amphenol Communications Solutions DILB16P-223TLF - Technical Attributes
Attributes Table
Type: DIP Socket
Style: PCB Through Hole
No of Pins: 16
Termination Style/Mounting: Solder
Terminal Pitch: 2.54mm
Contact Material: Copper Alloy
Rated Current: 1A
Material: Polyester
Insulation Resistance: 1000MΩ
Operating Temp Range: -55°C to +105°C
No of Rows: 2
Dielectric Withstanding Voltage: 1000V
Mounting Method: Through Hole
Pricing Section
Global Stock:
7,239
USA:
7,239
On Order:
0
Factory Stock:Factory Stock:
0
Factory Lead Time:
10 Weeks
Minimum Order:
1
Multiple Of:
1
Total
$0.26
USD
Quantity
Unit Price
1
$0.255
125
$0.25
400
$0.245
1,250
$0.24
4,000+
$0.23
Product Variant Information section