Manufacturer Part #
573100D00000G
TO-252 Surface Mount 15.00 C/W Thermal Resistance D2 Semiconductor Heat Sink
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| Mfr. Name: | Boyd | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:4000 per Box | ||||||||||
| Date Code: | 2315 | ||||||||||
Product Specification Section
Boyd 573100D00000G - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
N/A
File
Date
Part Status:
Active
Active
Boyd 573100D00000G - Technical Attributes
Attributes Table
| Thermal Resistance: | 15°C/W |
| Material: | Matte Tin Plated |
| Dimension: | H 22.86mm x L 10.16mm x W 8mm |
Features & Applications
The 573100D00000G is a Surface mount heat sink for D-Pak (TO-252) package semiconductors.
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.
Specifications:
- Shape: Rectangular
- Length: 0.315" (8 mm)
- Width: 0.90" (22.86 mm)
- Height of Fin: 0.400" (10.16 mm)
- Material Finish: Tin
- Power Dissipation @ Temperature Rise: 0.75 W @ 30°C
- Thermal Resistance @ Forced Air Flow: 12.5°C/W @ 600 LFM
- Thermal Resistance @ Natural: 15°C/W
- Package: TO-252 (DPak)
Pricing Section
Global Stock:
19,619
USA:
19,619
On Order:
0
Factory Lead Time:
N/A
Quantity
Web Price
1
$3.79
15
$3.64
30
$3.57
100
$3.44
200+
$3.30
Product Variant Information section
Available Packaging
Package Qty:
4000 per Box
