Manufacturer Part #
573300D00000G
TO-263 Surface Mount 18.00 C/W Thermal Resistance D2 Semiconductor Heat Sink
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Boyd | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:500 per Box | ||||||||||
| Date Code: | 2421 | ||||||||||
Product Specification Section
Boyd 573300D00000G - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
N/A
File
Date
Part Status:
Active
Active
Boyd 573300D00000G - Technical Attributes
Attributes Table
| Thermal Resistance: | 18°C/W |
| Material: | Matte Tin Plated |
| Dimension: | H 10.16mm x L 26.16mm x W 12.7mm |
Features & Applications
The 573300D00000G is a Surface mount heat sink for D2 Pak (TO-263) package semiconductors.
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.
Specifications:
- Shape: Rectangular
- Length: 0.500" (12.70 mm)
- Width: 1.030" (26.16 mm)
- Height of Fin: 0.400" (10.16 mm)
- Power Dissipation @ Temperature Rise: 1.25 W @ 30°C
- Thermal Resistance @ Forced Air Flow: 8°C/W @ 300 LFM
- Thermal Resistance @ Natural: 18°C/W
- Package: TO-263 (D2Pak)
Pricing Section
Global Stock:
1,902
USA:
1,902
On Order:
0
Factory Lead Time:
6 Weeks
Quantity
Unit Price
1
$2.59
15
$2.54
30
$2.51
100
$2.46
200+
$2.41
Product Variant Information section
Available Packaging
Package Qty:
500 per Box
