Référence fabricant
ATECC608B-MAHCZ-S
ATECC608B Series 5.5 V 1 Wire Interface Cryptographic Authentication IC - UDFN-8
Microchip ATECC608B-MAHCZ-S - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:December 28, 2021: Issued initial notification.August 4, 2022: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 25, 2022. Updated subject, description and pre and post change summary table to change A194 as an additional lead frame material. Updated affected CPN list to include catalog part numbers (CPN) released prior issuance of the Final PCN.Description of Change:Qualification of A194 as an additional lead frame material for selected Atmel products available in 8L UDFN (2x3x0.6mm) package at MMT assembly site.Reason for Change:To improve productivity by qualifying A194 as an additional lead frame material at MMT assembly site.
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of A194 lead frame material for selected Atmel products available in 8L UDFN (2x3x0.6mm) package at MMT assembly site.Impacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity by qualifying A194 lead frame material at MMT assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:February 2022
Statut du produit:
Microchip ATECC608B-MAHCZ-S - Caractéristiques techniques
Supply Voltage: | 1.8V to 5.5V |
Supply Current: | 2mA to 3mA |
Interface: | I2C |
Operating Temp Range: | -40°C to +100°C |
Storage Temperature Range: | -65°C to +150°C |
No of Terminals: | 8 |
Moisture Sensitivity Level: | 3 |
Style d'emballage : | UDFN-8 |
Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
UDFN-8
Méthode de montage :
Surface Mount