Référence fabricant
ATECC608B-MAHCZ-S
ATECC608B Series 5.5 V 1 Wire Interface Cryptographic Authentication IC - UDFN-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :UDFN-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2239 | ||||||||||
Microchip ATECC608B-MAHCZ-S - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:December 28, 2021: Issued initial notification.August 4, 2022: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 25, 2022. Updated subject, description and pre and post change summary table to change A194 as an additional lead frame material. Updated affected CPN list to include catalog part numbers (CPN) released prior issuance of the Final PCN.Description of Change:Qualification of A194 as an additional lead frame material for selected Atmel products available in 8L UDFN (2x3x0.6mm) package at MMT assembly site.Reason for Change:To improve productivity by qualifying A194 as an additional lead frame material at MMT assembly site.
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of A194 lead frame material for selected Atmel products available in 8L UDFN (2x3x0.6mm) package at MMT assembly site.Impacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity by qualifying A194 lead frame material at MMT assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:February 2022
Microchip has released a new Product Documents for the ATECC608B CryptoAuthentication Device Summary Data Sheet of devices.Notification Status: FinalDescription of Change:1) Added ISLEEP current specification for Extended Industrial Temperature Range. Table 2-52) Added 3. ATECC608B Trust Platform Variants and Provisioning Services and notes 4 and 5 on Trust Platform Devices in the Product Identification System (PIS).3) Updated SMBUS tTIMEOUT specification. Table 2-44) Renamed tTIMEOUT for SWI Interface to tTIMEOUT-SWI because of duplication of parameter name. Table 2-3Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 29 October 2021
PCN Status:Final notificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MTAI as an additional final test site for selected ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B device families available in 8L UDFN (2x3x0.6mm) package.mpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve manufacturability by qualifying MTAI as an additional final test site.Change Implementation Status:In ProgressEstimated First Ship Date:June 18, 2021 (date code: 2125)
Statut du produit:
Microchip ATECC608B-MAHCZ-S - Caractéristiques techniques
| Supply Voltage: | 1.8V to 5.5V |
| Supply Current: | 2mA to 3mA |
| Interface: | I2C |
| Operating Temp Range: | -40°C to +100°C |
| Storage Temperature Range: | -65°C to +150°C |
| No of Terminals: | 8 |
| Moisture Sensitivity Level: | 3 |
| Style d'emballage : | UDFN-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
UDFN-8
Méthode de montage :
Surface Mount