Référence fabricant
25AA512T-I/SN
25AA512 Series 512 Kbit (64K x 8) 5.5 V SMT SPI Bus Serial EEPROM - SOIC-8
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2430 | ||||||||||
Microchip 25AA512T-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the 25AA512 512-Kbit SPI Bus Serial EEPROM Data Sheet of devices. Description of Change: Fixed clock bit count and page size errors on Byte Write and Page Write sequences. Made minor grammar and punctuation fixes throughout the document. Removed automotive product offering. Updated SOIC, PDIP and SOIJ package drawings.Reason for Change: To Improve Productivity
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Statut du produit:
Microchip 25AA512T-I/SN - Caractéristiques techniques
| Memory Density: | 512kb |
| Memory Organization: | 64 K x 8 |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Clock Frequency-Max: | 20MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount