Référence fabricant
MCP23008T-E/SO
MCP23008 Series 5.5 V 1.7 MHz 8-Bit I/O Expander with Serial Interface - SOIC-18
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1100 par Reel Style d'emballage :SOIC-18 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP23008T-E/SO - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the MCP23008/MCP23S08 8-Bit I/O Expander with Serial Interface of devices.Description of Change: Revision Includes:� Updated description in Section �Features�.� Updated Table 1-1.� Corrected drawings for MCP23008 in Section Package Types.� Corrected Section 1.6.1 �I/O Direction (IODIR) Register�� Corrected packages drawings in Section 3.0 �Packaging Information�.� Updated Section �Product Identification System�, with Automotive Qualified devices.� Minor text and format changes throughout.Reason for Change: To Improve Productivity
Revision History:October 12, 2020: Issued initial notification.February 13, 2021: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on February 28, 2021.Description of Change:Qualification of QMI-519 die attach material for selected products available in 28L SOIC (.300in) and 18L SOIC (.300in) packages at MTAI assembly site.Pre Change:Using 3280 die attach materialPost Change:Using QMI-519 die attach materialPre and Post Change Summary: see attachedImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve productivity by qualifying QMI-519 die attach materialChange Implementation Status:In ProgressEstimated First Ship Date:February 28, 2021 (date code: 2110)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: see attached
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Statut du produit:
Microchip MCP23008T-E/SO - Caractéristiques techniques
| Interface Type: | I2C |
| Clock Frequency-Max: | 1.7MHz |
| No of I/O Lines: | 8 |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Supply Current: | 1mA |
| Style d'emballage : | SOIC-18 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1100 par Reel
Style d'emballage :
SOIC-18
Méthode de montage :
Surface Mount