Référence fabricant
MCP6051-E/SN
MCP6051 Series 6 V 385 kHz Rail-to-Rail I/O Operational Amplifier - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP6051-E/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Statut du produit:
Microchip MCP6051-E/SN - Caractéristiques techniques
| Amplifier Type: | General Purpose |
| No of Channels: | 1 |
| Slew Rate-Nom: | 0.15V/µs |
| Input Offset Voltage-Max: | 150µV |
| Gain Bandwidth Product: | 385kHz |
| Average Bias Current-Max: | 100pA |
| Supply Voltage: | 1.8V to 6V |
| Common Mode Rejection Ratio: | 91dB |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 87dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 115dB |
| Phase Margin: | 61° |
| Low Noise: | 34nV/√Hz |
| Output Current: | 26mA |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP6051 series of family of operational amplifiers (op amps) has low input offset voltage (±150 μV, maximum) and rail-to-rail input and output operation.
This family is unity gain stable and has a gain bandwidth product of 385 kHz (typical). These devices operate with a single supply voltage as low as 1.8 V, while drawing low quiescent current per amplifier (30 μA, typical). These features make the family of op amps well suited for single-supply, high precision, battery-powered applications.
Features:
- Low Offset Voltage: ±150 μV (maximum)
- Low Quiescent Current: 30 μA (typical)
- Rail-to-Rail Input and Output
- Wide Supply Voltage Range: 1.8 V to 6.0 V
- Gain Bandwidth Product: 385 kHz (typical)
- Unity Gain Stable
- Extended Temperature Range: -40°C to +125°C
- No Phase Reversal
Applications:
- Automotive
- Portable Instrumentation
- Sensor Conditioning
- Battery Powered Systems
- Medical Instrumentation
- Test Equipment
- Analog Filters
View the complete MCP605x series of Operational Amplifiers
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount