Référence fabricant
MCP6004-E/SL
MCP6004 Series 6 V 1 MHz SMT Low-Power Operational Amplifier - SOIC-14
Microchip MCP6004-E/SL - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
Microchip MCP6004-E/SL - Caractéristiques techniques
No of Channels: | 4 |
Slew Rate-Nom: | 0.6V/µs |
Input Offset Voltage-Max: | 4.5mV |
Style d'emballage : | SOIC-14 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
This family operates from a single supply voltage as low as 1.8 V, while drawing 100 μA (typ.) quiescent current. Additionally, the MCP6001 supports rail-to-rail input and output swing, with a common mode input voltage range of VDD + 300 mV to VSS – 300 mV. This family of op amps is designed with Microchip’s
advanced CMOS process.
Features:
- Available in SC-70-5 and SOT-23-5 packages
- Gain Bandwidth Product: 1 MHz (typ.)
- Rail-to-Rail Input/Output
- Supply Voltage: 1.8 V to 5.5 V
- Supply Current: IQ = 100 μA (typ.)
- Phase Margin: 90° (typ.)
- Temperature Range:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
- Available in Single, Dual and Quad Packages
Applications:
- Automotive
- Portable Equipment
- Photodiode Amplifier
- Analog Filters
- Notebooks and PDAs
- Battery-Powered Systems
View the complete family of MCP6004 product family
Emballages disponibles
Qté d'emballage(s) :
57 par Tube
Style d'emballage :
SOIC-14
Méthode de montage :
Surface Mount