573100D00000G in Box by Boyd | Heatsinks | Future Electronics
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Boyd | 573100D00000G

Manufacturer Part #

573100D00000G

TO-252 Surface Mount 15.00 C/W Thermal Resistance D2 Semiconductor Heat Sink

ECAD Model:
Mfr. Name: Boyd
Standard Pkg:
Product Variant Information section
Date Code: 2315
Product Specification Section
Boyd 573100D00000G - Technical Attributes
Attributes Table
Thermal Resistance: 15°C/W
Material: Matte Tin Plated
Dimension: H  22.86mm x L  10.16mm x W  8mm
Features & Applications
The 573100D00000G is a Surface mount heat sink for D-Pak (TO-252) package semiconductors.

This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.

Specifications:

  • Shape: Rectangular
  • Length: 0.315" (8 mm)
  • Width: 0.90" (22.86 mm)
  • Height of Fin: 0.400" (10.16 mm)
  • Material Finish: Tin
  • Power Dissipation @ Temperature Rise: 0.75 W @ 30°C
  • Thermal Resistance @ Forced Air Flow: 12.5°C/W @ 600 LFM
  • Thermal Resistance @ Natural: 15°C/W
  • Package: TO-252 (DPak)?
Read More...
Pricing Section
Global Stock:
30,663
USA:
30,663
On Order:
0
Factory Stock:Factory Stock:
0
Factory Lead Time:
6 Weeks
Minimum Order:
1
Multiple Of:
1
tariff icon
Tariff charges may apply if shipping to the United States. An estimate of tariff charges will be calculated at checkout.
Total
$0.67
USD
Quantity
Unit Price
1
$0.665
40
$0.65
100
$0.635
250
$0.62
500+
$0.59
Product Variant Information section
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