Manufacturer Part #
MCP6G04-E/SL
QUAD 1.8V, 1 MHZ GAIN BLOCK, E TEMP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:57 per Tube Package Style:SOIC-14 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification Section
Microchip MCP6G04-E/SL - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
File
Date
Multiple Material Change
03/10/2015 Details and Download
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Active
Active
Microchip MCP6G04-E/SL - Technical Attributes
Attributes Table
| No of Channels: | 4 |
| Gain Bandwidth-Nom: | 900kHz |
| Slew Rate-Nom: | 4.5V/µs |
| Supply Voltage-Max: | 5.5V |
| Input Offset Voltage-Max: | 4.5mV |
| Package Style: | SOIC-14 |
| Mounting Method: | Surface Mount |
Pricing Section
Global Stock:
0
USA:
0
On Order:
0
Factory Lead Time:
7 Weeks
Quantity
Unit Price
57
$1.11
228
$1.09
570
$1.08
1,425
$1.07
2,280+
$1.06
Product Variant Information section
Available Packaging
Package Qty:
57 per Tube
Package Style:
SOIC-14
Mounting Method:
Surface Mount