Manufacturer Part #
MCP625-E/MF
MCP625 Series 5.5 V 20 MHz 2 Channel mCal Operational Amplifier - DFN-8LD
Microchip MCP625-E/MF - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
Microchip MCP625-E/MF - Technical Attributes
Amplifier Type: | General Purpose |
No of Channels: | 2 |
Slew Rate-Nom: | 10V/µs |
Input Offset Voltage-Max: | 200µV |
Gain Bandwidth Product: | 20MHz |
Average Bias Current-Max: | 5pA |
Supply Voltage: | 2.5V to 5.5V |
Common Mode Rejection Ratio: | 84dB |
Supply Current: | 2.5mA |
Output Type: | Rail to Rail |
Power Supply Rejection Ratio: | 76dB |
Operating Temp Range: | -40°C to +125°C |
DC Voltage Gain: | 126dB |
Phase Margin: | 60° |
Low Noise: | 13nV/√Hz |
Output Current: | 130mA |
Package Style: | DFN-8 |
Mounting Method: | Surface Mount |
Features & Applications
The MCP625 family of operational amplifiers feature low offset. At power-up, these op amps are self-calibrated using mCal.
Some package options also provide a calibration/chip select pin that supports a low power mode of operation, with offset calibration at the time normal operation is re-started. These amplifiers are optimized for high speed, low noise and distortion, single-supply operation with rail-to-rail output and an input that includes the negative rail.
Features:
- Gain Bandwidth Product: 20 MHz (typical)
- Short Circuit Current: 70 mA (typical)
- Noise: 13 nV/√Hz (typical, at 1 MHz)
- Calibrated Input Offset: ±200 μV (maximum)
- Rail-to-Rail Output
- Slew Rate: 10 V/μs (typical)
- Supply Current: 2.5 mA (typical)
- Power Supply: 2.5 V to 5.5 V
- Extended Temperature Range: -40°C to +125°C
Applications:
- Driving A/D Converters
- Power Amplifier Control Loops
- Barcode Scanners
- Optical Detector Amplifier
Available Packaging
Package Qty:
50 per Tube
Package Style:
DFN-8
Mounting Method:
Surface Mount