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  4. Vishay — PowerPAK® 8 x 8LR Top-Side-Cooled MOSFETs

Vishay — PowerPAK® 8 x 8LR Top-Side-Cooled MOSFETs

Vishay

 

Vishay PowerPAK® 8 x 8LR top-side-cooled MOSFETs

Shift heat away from the PCB. Increase system output

The PowerPAK® 8 x 8LR package redefines thermal management by moving the primary heat path from the PCB directly to the heatsink. This top-side-cooled architecture enables cooler PCB operation, higher power density, and simplified board design compared to traditional leaded and leadless packages.

By reducing reliance on heavy copper, thermal vias, and complex PCB layouts, designers gain greater flexibility while lowering overall system cost.

Features

  • Top-side cooling with direct thermal interface to heatsinks or enclosures
  • Up to 15 percent cooler PCB operation versus TO-LL at peak load
  • 28 percent smaller footprint than TO-LL
  • Wire-free clip construction reducing parasitic inductance and resistance
  • AEC-Q101 qualified for automotive environments
  • Robust performance at high temperatures

Applications

  • 48 V to 12 V DC to DC converters
  • Motor drive control
  • Battery disconnect and reverse polarity protection
  • Power distribution and load switching

 

Vishay PowerPAK® 8×8LR Top-Side-Cooled MOSFETs Graph

 


Vishay PowerPAK® 8×8LR Top-Side-Cooled MOSFETs

 

 

PowerPAK® 8X8LR