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Manufacturer Part #
MCP79402-I/ST
I2C GP RTCC, 64B SRAM, EUI-64, Projected EOL 2039-05-26
Microchip MCP79402-I/ST - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Impacts to Data Sheet:NoneReason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated First Ship Date:March 17, 2022 (date code: 2212)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Data Sheet - MCP79400/01/02 Battery-Backed I2C RTCC w/ SRAM and Protected EEPROM Data Sheet Document RevisionDescription of Change: 1) Updated Section 6.3. 2) Updated Product Identification System.Reason for Change: To Improve ProductivityNOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Microchip MCP79402-I/ST - Technical Attributes
Date Format: | YY-MM-DD-dd |
Time Format: | HH:MM:SS |
Interface: | I2C |
SRAM Size: | 512b |
Supply Voltage-Nom: | 1.8V to 5.5V |
Temperature Grade: | Industrial |
Operating Temp Range: | -40°C to +85°C |
Storage Temperature Range: | -65°C to +150°C |
Package Style: | TSSOP-8 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
100 per Reel
Package Style:
TSSOP-8
Mounting Method:
Surface Mount