Manufacturer Part #
A3P1000-FGG256
A3P1000 Series 177 I/O Field Programmable Gate Array LBGA-256
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:90 per Tray Package Style:LBGA-256 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2252 | ||||||||||
Microchip A3P1000-FGG256 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Release of updated Synplify Pro ME version S-2021.09M-SP2 FPGA synthesis software bundled with Libero SoC v2022.3Reason for Change:Release updated Synplify Pro ME version S-2021.09M-SP2 FPGA synthesis software bundled with Libero SoC v2022.3 to prevent incorrect Verilog mapping of RTL using increment/decrement operations (++ / --) while indexing into an array on the right-hand side (RHS) of an assignment statement, as described in the attached Customer Notice.
Description of Change:Release of updated Synplify Pro ME version S-2021.09M-SP2 synthesis software bundled with Libero SoC v2022.3 as described in the attached customer notification details.Reason for Change:Release updated Synplify Pro ME version S-2021.09M-SP2 synthesis software bundled with Libero SoC v2022.3 to prevent incorrect VHDL expression evaluation during compilation, when performing subtraction with a real constant number operand, and an additional division/multiplication operation that uses a variable. This is to fix a VHDL compiler issue that occurs in specific VHDL expressions.
Revision History:June 25, 2021: Issued initial notification.February 10, 2022: Issued final Notification under eSign# E000089324. Initial PCN was issued with reference Memo # ML062021004D & TRB# WW22. Attached the qualification report. Provided estimated first ship date to be on February 28, 2022.February 15, 2022: Re-issued the Final notification to correct the affected CPN list.Description of Change:Qualification of ASEM as a new assembly site for selected Microsemi products available in 144L, 256L, and 324L LFBGA, 281L and 288L TFBGA packages.Reason for Change:To improve productivity by qualifying ASEM as a new assembly site.
Revision History:June 25, 2021: Issued initial notification.February 10, 2022: Issued final Notification under eSign# E000089324. Initial PCN was issued with reference Memo # ML062021004D & TRB# WW22. Attached the qualification report. Provided estimated first ship date to be on February 28, 2022.Description of Change:Qualification of ASEM as a new assembly site for selected Microsemi products available in 144L, 256L, and 324L LFBGA, 281L and 288L TFBGA packages. Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying ASEM as a new assembly site.Note: Because of capacity constraints that have been observed throughout the industry there may be limited or no inventory available as identified in the pre-change.Change Implementation Status:In ProgressEstimated First Ship Date:February 28, 2022 (date code: 2210)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Part Status:
Microchip A3P1000-FGG256 - Technical Attributes
| System Gates: | 1000000 |
| No of I/O Lines: | 177 |
| Operating Frequency-Max: | 231MHz |
| Flash Size (Bits): | 144kb |
| RAM Size (Bits): | 147456b |
| Supply Voltage: | 1.425V to 1.575V |
| Operating Temp Range: | 0°C to 85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Interface Type: | Jtag |
| Current Rating: | 50mA |
| Input Type: | LVTTL/LVCMOS |
| Temperature Grade: | Commercial |
| Moisture Sensitivity Level: | 3 |
| Package Style: | LBGA-256 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
90 per Tray
Package Style:
LBGA-256
Mounting Method:
Surface Mount