Manufacturer Part #
SST39SF010A-70-4I-NHE
SST39SF Series 1 Mbit 128 K x 8 5 V Multi-Purpose Flash - PLCC-32
Microchip SST39SF010A-70-4I-NHE - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:April 25, 2022: Issued initial notification.August 08, 2022: Issued final notification. Attached the qualification report and provided an estimated ship date to be on September 10, 2022. Updated post change of Pin 1 orientation.Description of Change:Qualification of MTAI as an additional final test site for selected SST39SF040, SST39SF020A and SST39SF010A device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.
Description of Change:Qualification of MTAI as an additional final test site for selected SST39SF040, SST39SF020A and SST39SF010A device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of MTAI as an additional Scan/Pack process site and implement packing changes for selected products available in 32L PLCC (11.5x14x3.37mm) package.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve on-time delivery performance by qualifying MTAI as an additional Scan/Pack process site.Change Implementation Status: In ProgressEstimated First Ship Date: February 03, 2022 (date code: 2206)See attached PCN for full details
Part Status:
Microchip SST39SF010A-70-4I-NHE - Technical Attributes
Memory Density: | 1Mb |
Memory Organization: | 128 K x 8 |
Supply Voltage-Nom: | 4.5V to 5.5V |
Access Time-Max: | 70ns |
Package Style: | PLCC-32 |
Mounting Method: | Surface Mount |
Features & Applications
CMOS Multi-Purpose Flash (MPF) manufactured with SST proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. This device writes (Program or Erase) with a 4.5-5.5V power supply, and conforms to JEDEC standard pinouts for x8 memories.
Featuring high performance Byte-Program, provides a maximum Byte-Program time of 20 µsec (microsecond). Designed, manufactured, and tested for a wide spectrum of applications, these devices are offered with a guaranteed typical endurance of 10,000 cycles. Data retention is rated at greater than 100 years.
It is suited for applications that require convenient and economical updating of program, configuration, or data memory. For all system applications, they significantly improve performance and reliability, while lowering power consumption. They inherently use less energy during erase and program than alternative flash technologies. The total energy consumed is a function of the applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash technology uses less current to program and has a shorter erase time, the total energy consumed during any Erase or Program operation is less than alternative flash technologies. This device also improves flexibility while lowering the cost for program, data, and configuration storage applications.
To meet high density, surface mount requirements, offered in 32-lead PLCC and 32-lead TSOP packages. A 600 mil, 32-pin PDIP is also available.
SST’s SST39SF010A-70-4I-NHE is a 1Mb (128k x 8), 70 nano second, 5 volt, 32 lead Plastic Lead Chip Carrier (PLCC) in an Industrial Temperature specification.
Available Packaging
Package Qty:
30 per Tube
Package Style:
PLCC-32
Mounting Method:
Surface Mount