Manufacturer Part #
PI3B3126LEX
4 Bit 2 Port 3.3 V Surface Mount Individual Enables Bus Switch - TSSOP-14
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| Mfr. Name: | Pericom Saronix-eCera | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:TSSOP-14 Mounting Method:Surface Mount | ||||||||||
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Pericom Saronix-eCera PI3B3126LEX - Product Specification
Shipping Information:
ECCN:
PCN Information:
TITLEQualified Additional Assembly/Test (A/T) Sites, Wafer Fab IMD Backend, and Package Outline Dimension ChangeDESCRIPTION OF CHANGEThis PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified the following additional Assembly and Test (A/T) sites for select products: Diodes internal assembly and test site (SAT) located in Shanghai, China, and Shanghai SIMAT Microelectronics Technology (SIMAT) located in Shanghai, China, and Greatek located in Toufen, Taiwan.Diodes has also qualified high-density plasma (HDP) oxide chemical vapor deposition (CVD) as new intermetallic dielectric (IMD) material and process for select products. Some products will also be subject to a change of a respective package outline dimension (POD), in particular package height.Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure no change to device functionality or electrical specifications in the datasheet. Refer to the attached qualification report embedded in this file (to view, download this PCN file then open it with a PDF viewer to see the attached qual report).
Part Status:
Pericom Saronix-eCera PI3B3126LEX - Technical Attributes
| Family: | PI3 |
| Logic Circuit: | Bus Switch |
| No of Functions / Channels: | 4 |
| Supply Voltage-Nom: | 3.3V |
| Package Style: | TSSOP-14 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Package Style:
TSSOP-14
Mounting Method:
Surface Mount