Manufacturer Part #
MSC2X30SDA170J
Discrete Semiconductor Modules SIC SBD 1700 V 30 A Dual Anti-Parallel ISOTOP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:10 per Tube | ||||||||||
| Date Code: | 2050 | ||||||||||
Microchip MSC2X30SDA170J - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:September 20, 2022: Issued initial notification.May 3, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on May 30, 2023.PCN Type:Manufacturing Change Description of Change:Qualification of Microchip Technology Colorado � Fab 5 (MCSO) as an additional fabrication site for selected 1700V SiC Schottky Barrier Diode (SBD) products of MSC010SDA170xx, MSC030SDA170xx, MSC050SDA170xx, MSC2X3xSDA170J, and MSC2X5xSDA170J device families available in die sales products, 2L TO-247, and 4L SOT-227 packages.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity and on-time delivery performance by qualifying MCSO as an additional fabrication site.Change Implementation Status:In ProgressEstimated First Ship Date:May 30, 2023 (date code: 2322)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
PCN Status:Final NotificationDescription of Change:Implement top marking changes for selected PSDS (Power Switching Discrete Solutions) Silicon Carbide (SiC) Products available in TO-247, TO-263, TO-268, TO-220 and SOT-227 packages.Reason for Change:To improve productivity by standardizing the top marking as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated First Ship Date:March 31, 2023 (date code: 2313)
PCN Status:Final NotificationPCN Type:Manufacturing ChangeMicrochip Parts Affected:Please open one of the files found in the Affected CPNs section.Note: For your convenience Microchip includes identical files in two formats (.pdf and .xls)Description of Change:Implement Microchip Inner Labels and documentation changes for selected PSDS (Power Switching Discrete Solutions) Silicon Carbide (SiC) Products.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by standardizing the packing method as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated First Ship Date:February 17, 2023 (date code: 2307)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
PCN Status:Initial NotificationDescription of Change:Qualification of Microchip Technology Colorado � Fab 5 (MCSO) as an additional fabrication site for selected 1700V SiC Schottky Barrier Diode (SBD) products of MSC010SDA170xx, MSC030SDA170xx, MSC050SDA170xx, MSC2X3xSDA170J, and MSC2X5xSDA170J device families available in die sales products, 2L TO-247, and 4L SOT-227 packages.Reason for Change:To improve productivity and on-time delivery performance by qualifying MCSO as an additional fabrication site.
Part Status:
Available Packaging
Package Qty:
10 per Tube