Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.
Please contact your salesperson for assistance.
Manufacturer Part #
AT24C64D-XHM-T
AT24C64D Series 64 Kb (8 K x 8) 1.7 V I2C-Compatible Serial EEPROM - TSSOP-8
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:TSSOP-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2331 | ||||||||||
Microchip AT24C64D-XHM-T - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
Description of Change:Qualification of Au and CuPdAu as a new wire material, AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound material for selected 24AA32xx, 24AA64x, 24FC64x, 24LC32xx, 24LC64xx, AT24C32x and AT24C64x device families available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying Au and CuPdAu as a new wire material, AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound material.Change Implementation Status:In ProgressEstimated First Ship Date:31 March 2025 (date code: 2514)
Description of Change: This qualification was originally performed to qualify MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change: Microchip has decided to not qualify MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
PCN Status:Final NotificationDescription of Change:Qualification of Au and CuPdAu as a new wire material, AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound material for selected 24AA32xx, 24AA64x, 24FC64x, 24LC32xx, 24LC64xx, AT24C32x and AT24C64x device families available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying Au and CuPdAu as a new wire material, AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound material.
***FPCN110207 UPDATE***Revision History:May 22, 2023: Issued initial notification.July 01, 2024: Issued final notification. Attached the Qualification Report. Updated the pre and post change summary table to include Lead frame design information. Provided estimated first ship date to be on July 22, 2024.November 29, 2024: Re-issued final notification to reflect wire material Au in ANAP and ASSH assembly sites in the Pre and Post Change Summary.January 15, 2025: Re-issued final notification to reflect mold compound CEL-8240HF10P material in ANAP assembly site in the Pre and Post Change Summary. January 23, 2025: Re-issued the final notification to revise the comparison PDF file and reflect the mold compound CEL-8240HF10P material in ANAP assembly site.Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
***July 01, 2024: Issued final notification. Attached the Qualification Report***Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
Part Status:
Microchip AT24C64D-XHM-T - Technical Attributes
| Memory Density: | 64kb |
| Memory Organization: | 8 K x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Supply Current: | 2mA |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Data Retention: | 100 yr |
| Interface Type: | I2C |
| Access Time-Max: | 550ns |
| Operating Temp Range: | -40°C to +85°C |
| No of Terminals: | 8 |
| Package Style: | TSSOP-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
5000 per Reel
Package Style:
TSSOP-8
Mounting Method:
Surface Mount