
Manufacturer Part #
PIC16F648AT-I/SO
PIC16F Series 7 kB Flash 256 B RAM 20 MHz 8-Bit Microcontroller - SOIC-18
Product Specification Section
Microchip PIC16F648AT-I/SO - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
File
Date
Multiple Material Change
02/19/2015 Details and Download
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Part Status:
Active
Active
Microchip PIC16F648AT-I/SO - Technical Attributes
Attributes Table
Family Name: | PIC16 |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 7kB |
RAM Size: | 256B |
Speed: | 20MHz |
No of I/O Lines: | 16 |
InterfaceType / Connectivity: | USART |
Peripherals: | Analog Comparators/PWM/USART/Watchdog |
Number Of Timers: | 3 |
Supply Voltage: | 3V to 5.5V |
Operating Temperature: | -40°C to +85°C |
Watchdog Timers: | 1 |
Package Style: | SOIC-18 |
Mounting Method: | Surface Mount |
Features & Applications
Pricing Section
Global Stock:
1,100
USA:
1,100
On Order:
0
Factory Lead Time:
6 Weeks
Quantity
Unit Price
1,100+
$3.44
Product Variant Information section
Available Packaging
Package Qty:
1100 per Reel
Package Style:
SOIC-18
Mounting Method:
Surface Mount