
Manufacturer Part #
2N7000-G
N-Channel 60 V 5 Ohm 1 W Through Hole Power Mosfet - TO-92
Microchip 2N7000-G - Product Specification
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Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication site for multiple device families of DMOS2.5 (63K, 6K, 6FK, 6GK, 6HK) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025
Revision History:November 8, 2021: Issued initial notification.May 16, 2022: Issued final notification. Attached is the qualification report. Provided estimated first ship date on June 30, 2022.Description of Change:Qualification of CEL-8240 as a new mold compound for 2N700x, DNx5xxN3, LP0701N3, TxxxxxN3, VNxxxxxx and VPxxxxxx device families available in 3L TO-92 package assembled at CRTK assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying CEL-8240 as a new mold compound at CRTK assembly site.
Part Status:
Microchip 2N7000-G - Technical Attributes
Fet Type: | N-Ch |
No of Channels: | 1 |
Drain-to-Source Voltage [Vdss]: | 60V |
Drain-Source On Resistance-Max: | 5Ω |
Rated Power Dissipation: | 1|W |
Gate-Source Voltage-Max [Vgss]: | 30V |
Drain Current: | 200mA |
Operating Temp Range: | -55°C to +150°C |
Gate Source Threshold: | 3V |
Height - Max: | 5.33mm |
Length: | 5.21mm |
Input Capacitance: | 60pF |
Package Style: | TO-92 |
Mounting Method: | Through Hole |
Available Packaging
Package Qty:
1000 per Reel
Package Style:
TO-92
Mounting Method:
Through Hole