
Manufacturer Part #
DSEI2X101-06A
DSEI Series 600 Vrrm 2 X 96 A 1.25 Vf Epitaxial Diode - SOT-227B
Littelfuse – IXYS DSEI2X101-06A - Product Specification
Shipping Information:
ECCN:
PCN Information:
Littelfuse would like to notify you that we have qualified alternative Epoxy Molding Compound (EMC) material for various IXYS Brand Thyristor & Diode Discrete Packages to serve the Business Continuity Plan (BCP).Package types includes : TO-262, TO-3P, TO-247, SOT227, TO-268, TO-263, TO-220.All affected IXYS Brand Thyristor & Diode Discrete products have been fully qualified in accordance with established performance and reliability criteria using alternative EMC. The attached pages summarized the qualification results. Full qualification data and/or samples will be available upon request.Form, fit, function changes: No Fit/Form/Function change with alternative EMC.Effective date: August 10th, 2024
This is a updated declaration letter associated to ESW490-40 - IXYS Thy & Diode I4Pac&GUFP Package; ESW490-44 - IXYS Thy & Diode TO247_ISO247_PLUS247_ISOPLUS247Package; ESW490-47 - IXYS Thy & Diode SOT-227 Package; PCN # ESW490-48 – IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer. Littelfuse will change the MOQ/MDQ/DU for IXYS Power Thyristor & Diode products aligning to manufacture requirement.
This is a updated declaration letter associated to ESW490-40 - IXYS Thy & Diode I4Pac&GUFP Package; ESW490-44 -IXYS Thy & Diode TO247_ISO247_PLUS247_ISOPLUS247Package; ESW490-47 - IXYS Thy & Diode SOT-227 Package; PCN # ESW490-48 – IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer. Littelfuse will change the MOQ/MDQ/DU for IXYS Power Thyristor & Diode products aligning to manufacture requirement. Detail affected part number list refer to Appendix.
Littelfuse would like to notify you that we will transfer our backend assembly process of Thyristor & Diode products SOT-227 Package to our new inhouse assembly factory in Lipa, Philippines. This brand-new assembly factory is to fulfill our strategy to invest in state-of-the-art power semiconductor assembly capabilities to dramatically improve our service levels to customers. Our target is to build this factory as a world class facility with automated, error proof processes to meet the highest quality standards. Contact our local Sales team in case you would like to understand more about this new factory. Below is the detail changes associate with this Assembly Location change: 1) Silicon Die: No change 2) Backend Assembly Bill of Materials: No change 3) Backend Assembly Process Flow: Some part numbers change from Pad type to Padless type. Refer to PCN report. 4) Backend Assembly Equipment: Equal or better 5) Marking & Labeling: Yes.
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
We want to share with you a brief update on the Littelfuse power semiconductor manufacturing site in Lampertheim, Germany. The site recently experienced an electrical fire that occurred at the power distribution panel on the subfloor of the fab. All employees were safely evacuated, and the site has resumed some operations. The fire did not spread to the manufacturing floor, but this unforeseeable event will cause an interruption to our production. As a result of this incident, despite our urgent recovery actions, you will encounter approximately a 10 week delay to your current delivery schedule for our thyristors rectifier, and fast diodes, as well as any module that includes these components. We sincerely apologize for the inconvenience. Your Littelfuse Customer Service Representative will make the necessary adjustments to your order and also contact you if there are any further changes to this schedule. Please understand that our entire global team is diligently working to resolve this issue as fast as possible to minimize your disruption.
Part Status:
Littelfuse – IXYS DSEI2X101-06A - Technical Attributes
Average Rectified Current-Max: | 96A |
Reverse Voltage-Max [Vrrm]: | 600V |
Reverse Current-Max: | 3mA |
Forward Voltage: | 1.25V |
Reverse Recovery Time-Max: | 50µs |
Package Style: | SOT-227B |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
10 per Tube
Package Style:
SOT-227B
Mounting Method:
Surface Mount