
Manufacturer Part #
MCP619-I/SL
MCP619 Series 5.5 V 190 kHz Micropower Bi-CMOS Operational Amplifier - SOIC-14
Microchip MCP619-I/SL - Product Specification
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Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip MCP619-I/SL - Technical Attributes
Amplifier Type: | General Purpose |
No of Channels: | 4 |
Slew Rate-Nom: | 0.08V/µs |
Input Offset Voltage-Max: | 150µV |
Gain Bandwidth Product: | 190kHz |
Average Bias Current-Max: | -5nA |
Supply Voltage: | 2.3V to 5.5V |
Common Mode Rejection Ratio: | 100dB |
Output Type: | Rail to Rail |
Power Supply Rejection Ratio: | 105dB |
Operating Temp Range: | -40°C to +85°C |
DC Voltage Gain: | 115dB |
Phase Margin: | 57° |
Low Noise: | 32nV/√Hz |
Output Current: | 17mA |
Package Style: | SOIC-14 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
57 per Tube
Package Style:
SOIC-14
Mounting Method:
Surface Mount